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With the continuous development of society, semiconductor and integrated circuit has become the theme of The Times, which directly affects the mechanical properties of semiconductor and integrated circuit is the process of chip packaging, chip packaging has been a major problem in industrial production, how to overcome this problem, and how to apply it in the chip packaging industry?

First, chip bonding

The printed circuit board is prone to displacement in the welding process, in order to avoid the electronic components from the printed circuit board surface off or shift, can be used automatic dispensing machine on the surface of the printed circuit board dispensing, and then into the oven heating and curing, so that the electronic components firmly attached to the printed circuit board.

Two, the bottom material filling

I believe many technicians have encountered such a problem, in the flip chip process, because the fixed area is smaller than the chip area, so it is difficult to bond, if the chip is impacted or thermal expansion, it is easy to lead to convex or even crack, the chip will lose its proper performance. To solve this problem, we can inject organic glue into the gap between chip and substrate through automatic dispensing machine, and then cure, which effectively increases the connection between chip and substrate. It further improves their bond strength and provides good protection for the bulge.

Three, surface coating

When the chip welding, can be between the chip and the solder joint through the automatic dispensing machine coated with a layer of low viscosity, good fluidity of epoxy resin and curing, not only improves the appearance of the grade, but also can prevent the corrosion and stimulation of external objects, play a good protective role on the chip, prolong the service life of the chip.

To sum up, the above is the automatic dispensing machine in the chip packaging industry chip bonding, primer filling, surface coating and other applications, we can apply this method to the usual work, it will greatly improve our work efficiency, with this method, you don't have to worry about the chip packaging problem!